Wide band-gap semiconductors demand new thinking materials and interconnect techniques: – Most interconnection at the packaging level with power devices uses aluminum wires in parallel arrays. This approach is satisfactory with Silicon because power density and thermal limitations constrain both die size and spacing. The area that
Read more →The Exciting New World of Wide Band-Gap – Solid State Power:- Power semiconductor technologies are approaching an important threshold with both technical and commercial implications. The changing performance metrics will have dramatic consequent impact on the requirements of board level interconnect while the market potential will create
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